We provide innovative, high-performance cleaning materials and application-specific engineering solutions to the semiconductor market. Our cleaning material solutions enable our customers to reduce defectivity, maximize yield, improve tool uptime, and reduce production costs.

Our product portfolio includes a wide array of advanced cleaning products that serve the front-end, wafer test, and back-end (advanced packaging) semiconductor manufacturing ecosystem. Our solutions are specifically tailored to keep pace with new technology nodes and address the evolving demands of our customer-base.

Probe Clean™
• Non-abrasive debris collection.
• Applicable for all probe types.

Probe Polish™
• Light polishing with loose & bonded debris collection.
• Applicable for flat, radius, semi-radius tips and all vertical technologies.

Probe Scrub™
•Light contact surface abrasion with debris collection
•Applicable for flat tip probes at ambient and elevated temperature.

Probe Lap™
Precision lapping film specifically designed for probe needle cleaning

Probe Form™
•Used off-line to attain shaped Probe Tips.
•Probe Card life extension.

Test Cell Conditioner (TCC)
•Debris removal at package test.
•Polymer material actuated into contact with the spring pins to remove and collect debris.